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MA4SPS302 SurMountTM Series TM
Surface Mount Monolithic PIN Diode Chip
Features
* * * * * * * Surface Mount Diode No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance
High Power Handling (Efficient Heatsinking)
Case Style ODS-12471, 2
A
B
Description
M/A-COM's MA4SPS302 is a silicon-glass PIN diode fabricated with M/A-COM's patented HMICTM process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal side walls conductive. Selective backside metalization is applied producing a surface mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly.
C
D
E
D
D
Applications These devices can be used in series and shunt switches for wireless circuits where smaller area and profile are required. Low parasitic values of L and C make additional circuit tuning unnecessary. 2 R S value @ 1 mA makes the devices suitable for smaller current consumption applications.
1. 2.
Backside metal: 0.1 micron thk. gold. Hatched areas indicate bond pads.
Absolute Maximum Ratings1
@ T A = +25C (unless otherwise specified)
Parameter Reverse Voltage Forward Current Operating Temperature Storage Temperature Mounting Temperature Absolute Maximum -70 V 100 mA -65C to +150C -65C to +150C +235C for 10 seconds
DIM. A B C D E
INCHES MIN. MAX. 0.0520 0.0583 0.0201 0.0264 0.0040 0.0080 0.0180 0.0200 0.0140 0.0160
MILLIMETERS MIN. MAX. 1.320 1.480 0.510 0.670 0.102 0.203 0.457 0.508 0.355 0.406
1. Exceeding these limits may cause permanent damage.
Specifications subject to change without notice. n North America: Tel. (800) 366-2266, Fax (800) 618-8883 n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 Visit www.macom.com for additional data sheets and product information.
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Surface Mount Monolithic PIN Diode Chip Electrical Specifications @ +25C
Symbol CT CT RS RS VF VR IR TL -40 Volts, 1 MHz -40 Volts, 1 GHz
1 1, 3
MA4SPS302 SurMountTM Series TM
Test Conditions
Units pF pF

Min.
Typ. 0.400 0.300 1.0 1.3 0.84
Max. 0.450
10 mA, 100 MHz 2, 10 mA, 1 GHz 10 mA 10 A -70V 10 mA / 6 mA
2, 3
V V
A
1.00
-70
-120 10 460
ns
1. Total capacitance is equivalent to the sum of junction capacitance C j and parasitic capacitance. 2. Series resistance RS is equivalent to the total diode series resistance including the junction resistance Rj. 3. RS and CP is measured on an HP4291A with die mounted in an ODS-186 package with conductive silver epoxy.
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized.
Functional Schematic1
Ls
ESD These devices very susceptible to ESD and are rated Class 0 (0-199V) per HBM MIL-STD-883, method 3015.7 [C = 100pF 10%, R = 1.5k 1%]. Even though tested die pass 100V ESD, they must be handled in a static-free environment.
Rp
Cp
Bonding Techniques
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these diodes and are removed from the active junction locations. These diodes are well suited for solder attachment onto hard and soft substrates. The use of 80/20 Au/Sn and 60/40 Sn/Pb solder is recommended. Conductive epoxy paste for attachment may also be used, this can be silk-screened, or used with a conductive sheet apoxy. When soldering these diodes to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and a force of 60 to 100 grams applied normal to the top surface of the part. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board's mounting pads Reflow the solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. Since the HMICTM glass is transparent, the edges of the mounting pads closest to each other can be visually inspected through the die after attach is completed.
Specifications subject to change without notice. n North America: Tel. (800) 366-2266, Fax (800) 618-8883 n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 Visit www.macom.com for additional data sheets and product information.
Rvia
Rvia
1. Rs = 2 * Rvia + Rp
+
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Surface Mount Monolithic PIN Diode Chip Typical Performance Curves @ +25C
Typical Total Resistance RS vs. Forward Current and Frequency
3
MA4SPS302 SurMountTM Series TM
Typical Total Capacitance CP vs. Reverse Voltage and Frequency
0.600 0.500
Rs (Ohm)
2
0.400
Cp (pF)
0.300 0.200 0V -5V 0.100 0.000 -40V
1 500uA 0 0 100 200 300 400 500 600 700 800 900 1000 1mA 2mA 10mA 50mA
0
100
200
300
400
500
600
700
800
900
1000
FREQUENCY (MHz)
FREQUENCY (MHz)
Cp vs. V @ 100 MHz and 1 GHz
0.600 0.550 0.500
1.E+06
Rp vs. V @ 100 MHz and 1 GHz
Rp ( Ohms )
100 MHz
Cp ( pF )
0.450 0.400 0.350 0.300 0.250 0.200 0.00 5.00 10.00 15.00 20.00 25.00 30.00 35.00 40.00 1 GHz
1.E+05
1 GHz
1.E+04
100 MHz
1.E+03 0.00
5.00
10.00
15.00
20.00
25.00
30.00
35.00
40.00
V
V
Rs vs I @ 100 MHz and 1 GHz
10.00
Ls vs. Frequency @ 10 mA
0.500 0.490 0.480 0.470 0.460 0.450 0.440 0.430 0.420 0.410 0.400 500.0
100 MHz
Rs ( Ohms )
1 GHz
1.00
0.10 0.01
Ls ( nH )
0.10
1.00
10.00
100.00
700.0
900.0
1100.0
1300.0
1500.0
1700.0
I ( mA )
FREQUENCY ( MHz )
Specifications subject to change without notice. n North America: Tel. (800) 366-2266, Fax (800) 618-8883 n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 Visit www.macom.com for additional data sheets and product information.
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